16 drive Rugged HPC Server
Engineered to handle massive workloads anywhere, Mercury’s RES AI 3U supercomputing server packs up to two Intel® Xeon® Scalable processors, five double-wide NVIDIA Tesla GPUs, 4TB DDR4 ECC memory, and 240TB of storage in a compact 38lb server form-factor.
Equipped with 11 PCIe 3.0 slots that accommodate a mix of GPUs, FPGA accelerators and other expansion cards, RES AI 3U accelerates an array of High Performance Computing (HPC) workloads in the field by consolidating multiple capabilities into a single platform. Sixteen hot-pluggable, front-access drives support the latest 2.5″, 15mm high and 7mm high SAS3, SATA and NVME drives and can be configured for redundancy.
To ensure sustained optimal performance in almost any environment, our 3U server minimizes airborne and structural noise and is certified to multiple International Electrotechnical Commission (IEC) and military standard specifications including MIL-STD 810G, 901D, 167-1, 1474D, 740-2, and 461F. Patented memory stabilization technology prevents disconnect during system shock and vibration.
Powered by five of the latest NVIDIA® Volta architecture GPUs, RES AI 3U harnesses parallel processing to maximize throughput, boost productivity and push the boundaries of compute-heavy mission-critical applications such as signal intelligence (SIGINT), cryptography, deep learning, artificial intelligence (AI), surveillance, sensor fusion, visualization, image processing, tracking and big data analytics. Other GPU options are available.
Compatible with multiple operating systems, applications and software, RES AI adheres to open standards and integrates the latest commercial technologies to support supercomputing from the Cloud to the Edge.
The RES AI 3U is designed in the U.S. and manufactured in AS5553 compliant, AS9100D and ISO9001 facilities to maintain stringent quality standards.
Patented Technology Options
In addition to memory stabilization, this server features numerous patented technology options including:
2 Intel® Xeon® Scalable CPUs with up to 28 cores per processor
Bronze, Silver, Gold, or Platinum
Up to 5 double-wide NVIDIA Tesla or Quadro GPU accelerators
Up to 4TB 2933MHz memory
Patented Technologies
Memory stabilization
Aeroloc baffle system
System control module for acoustic and remote management
Management and Operating System
Windows®, Linux®, VMWARE® and other hypervisors
IPMI v2.0, Redfish option available
TPM 1.2 or 2.0 support
Expansion and Modular Maintainability
Up to 6 PCIe 3.0 x16 or 11 PCIe 3.0 x8 cards
1 Internal M.2 PCIe drive
Input/Output Versatility
Front Access
Up to 16 removable, hot pluggable, 2.5” SATA/SAS3 drives, U.2 NVME option available
can configure with up to (8) 15mm or (16) 7mm (SATA) high drives
1 Power/Reset Switch
1 Power on LED
1 Quick change CMOS battery
1 Blu-Ray or DVD/CD ROM drive (optional)
2 USB 3.0
1 RS-232
Rear Access
2 1GBaseT or 10GBaseT Ethernet Ports (RJ45)
1 IPMI 2.0 (RJ45)
1 CFM Switch (optional)
2 USB 3.0 (optional)
1 RS-232 (optional)
Power Supply Options
Single 100/240V VAC (47/63Hz, 400Hz)
Single 10-36 VDC, 32 Amps
Single 36-72 VDC, 18 Amps
MIL-STD 461, 704F, 1399-300B
Additional Options
Front door filter
Slide rails
CAC card reader
Read/Write switches to prevent accidental rewrite
MIL-STD / Industrial Specifications
MIL-STD 810G
Shock: MIL-STD 901D Grade A, IEC 60068-2-27
EMI/RFI: MIL-STD 461F, CE102 standard
Vibration: MIL-STD 167-1, MIL-STD 810G, IEC 60068-2-64
Airborne noise: MIL-STD 1474D
Structure borne noise: MIL-STD 740-2
Temperature: IEC 60068-2-2 test Bb, 60068-2-1 test Ab
Environmental*
Operating
Temperature: 0°C to 50°C
Extended Temperature: -15°C to 65°C
Humidity: 5% to 95% (non-condensing)
Shock: 3 axis, 35g, 25ms
Vibration: 4.76Grms, 4Hz to 2000 Hz (SSD)
Altitude: 10,000 ASL
Non-Operating
Temperature: -40°C to 80°C
Humidity: 5% to 95% (non-condensing)
Altitude: 40,000 ASL
Conformal Coating: IPC-CC 830 (optional)
Mechanical
Height: 3U or 5.25” inches (133.35mm)
Width: 17 inches (431.8mm)
Depth: 20 inches (208mm)
Weight (Typical)*:
Steel Chassis: 38lbs (17.2kg)
Cooling: Internal fan-cooled (rear vent) front to rear
19” rackmountable
* Mercury Systems designs all products to meet or exceed listed data sheet specifications. Some specifications including I/O profiles, weight, and thermal profiles are configuration dependent. Contact Mercury for information specific to your desired configuration requirements.