- XP i.MX 8M Plus applications processor
- Up to four Cortex-A53 1.8 GHz processors
- Cortex-M7 processor with speeds up to 800 MHz
- Neural Processing Unit (NPU)
- Image Signal Processor (ISP)
- Armv8 64-Bit CPU cores
Starting from USD 51
64-bit Performance
The NXP i.MX 8M Plus SoC is packed with four 64-bit Armv8 Cortex-A53 cores, making them a cost-effective choice for running a modern graphical user interface while providing sufficient power reserves for typical industrial and medical applications.
Certified Connectivity
Simplify your design with pre-certified wireless options — from the module to the antennas — to make end-device certification processes more predictable while cutting costs.
Rugged and Reliable
Our System-on-Modules are available in industrial grade configurations to withstand the worst environmental challenges your embedded product might face.
Interfaces
Packed with a wide array of interfaces Our System-on-Modules are as a Swiss Army knife when connecting over serial port, CAN bus, I2C, SPI or USB.
Camera Integration
Machine Vision camera modules and complete off-the-shelf solutions available from TechNexion. Seamless integration and optimized from the first day of your project.
Machine Learning / AI
The integrated neural network processing unit (NPU) was designed from the ground up to execute deep learning inference, and to outperform CPU- and GPU-based solutions in the same power range by several times.
Software Platform
As a true opensource software advocate. TechNexion products are supported with a sourcecode BSP Linux and Android AOSP. Third party consultants can tailor solutions easily to make every embedded project a success.
Pin Compatible
Scalability at it’s finest is what sets TechNexion System-on-Modules apart. A single carrier board can host from a low-power i.MX8M Nano to a powerful SOC with integrated NPU that the i.MX8M Plus brings to the EDM System-on-Module family.
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| Core System |
| Processor |
NXP i.MX8M Plus |
| Architecture |
ARM Cortex-A53 + M7 |
| AI / ML |
NN Accel 2.3 TOPS |
| PMIC |
NXP PCA9450 |
| Memory |
Upto 8GB LPDDR4 |
| Storage |
32GB eMMC (default) |
| Board-to-Board Connector |
260-pin DDR4 SO-DIMM |
| System on Module |
EDM SOM |
| Debug Interface |
JTAG Interface by Through-hole |
|
| Connectivity |
| Network LAN |
1x Atheros AR8035 Gigabit LAN |
| Wi-Fi |
Qualcomm Atheros QCA9377 Wi-Fi 5 – 802.11 a/b/g/n/ac (optional) |
| Bluetooth |
Qualcomm Atheros QCA9377 Bluetooth (optional) |
| Antenna |
MHF4 connector (optional) |
|
| Signaling |
| I/O |
HDMI
LVDS
LAN
MIPI CSI
MIPI DSI
PCIe
USB
I²S
SDIO
CAN
UART
SPI
I²C
PWM
GPIO |
|
| Video |
| GPU Engine |
GC520L (2D)
Vivante GC7000UL |
| Video decode |
1080p60 (h.265, h.264, VP9, VP8) |
| Video encode |
1080p60 (h.265, h.264) |
| Camera |
Dual MIPI CSI (4 lanes) |
|
| Audio |
| Audio Codec |
On carrier board |
| Audio Interface |
I²S (2 channel) |
|
| Power Specifications |
| Power Input |
5V DC +/-5% |
| Power Consumption |
Depending on Configuration |
|
| Operating Systems |
| Standard Support |
Linux
Yocto
Android
Ubuntu |
| Extended Support |
Boot2Qt
Commercial Linux
FreeRTOS
Real Time OS |
|
| Certification and Compliance |
| FCC |
FCC ID: 2AKZA-QCA9377 |
| IC |
IC: 22364-QCA9377 |
| CE |
EN 300 328 v2.2.2
EN 301 893 v2.1.1
EN 55032 / EN 55024 |
| TELEC (Japan) |
TELEC: 201-180629 |
| RCM (Australia/New Zealand) |
RCM Compliant |
| Certification |
Compliant with RoHS / REACH directives |
| Bluetooth Logo |
QDID 150839 (Bluetooth 4.2) |
|
| Environmental and Mechanical |
| Dimensions |
69.6 x 35mm |
| Form Factor |
EDM Type G |
| Relative Humidity |
10 to 90 % |
| MTBF |
100,000+ Hours |
| Shock |
15G half-sine 11 ms duration |
| Operation Temperature |
Commercial: 0° to +60° C
Industrial: -40° to +85° C |
| Vibration |
1 Grms random 5-500Hz hr/axis |
| Weight |
8 grams |
|
| Shop Data |
| Brand |
TechNexion |
| Country of Origin |
Taiwan |
| HTSN |
8473.30.1180 |
| ECCN |
5A992.c Mass Market |
| CCATS |
Mass Market (No License Required) |
| REACH / RoHS |
YES |
|
