- Modern System on Module form factor
- Up to four Cortex-A53 1.8 GHz processors
- NXP i.MX 8M Mini applications processor
- Armv8 64-Bit CPU cores
Performance
The NXP i.MX8M mini low-power 64-bit Arm Cortex-A53 brings a Full-HD multimedia user experience for ubiquitous IIOT and Edge applications.
Certified Connectivity
Simplify your design with pre-certified wireless options — from the module to the antennas — to make end-device certification processes more predictable while cutting costs.
Rugged and Reliable
Our System-on-Modules are available in industrial grade configurations to withstand the worst environmental challenges your embedded product might face.
Interfaces
Packed with a wide array of interfaces Our System-on-Modules are as a Swiss Army knife with a wide array of interfaces ranging from GPIO, PWM to I²C, SPI, UART and USB.
Camera Integration
Machine Vision camera modules and complete off-the-shelf solutions available from TechNexion. Seamless integration and optimized from the first day of your project.
Power Optimized
One of the best choices when designing an embedded device when power and performance are in a stand-off and choosing sides is not an option. Take advantage of 64-bit processing power at minimum power usage requirements.
Software Platform
As a true opensource software advocate. TechNexion products are supported with a sourcecode BSP Linux and Android AOSP. Third party consultants can tailor solutions easily to make every embedded project a success.
Pin Compatible
Scalability at it’s finest is what sets TechNexion System-on-Modules apart. A single carrier board can host from a low-power i.MX8M Nano to a powerful SOC with integrated NPU that the i.MX8M Plus brings to the EDM System-on-Module family.
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Core System |
Processor |
NXP i.MX8M Mini |
Architecture |
ARM Cortex-A53 + M4 |
AI / ML |
OpenCL CPU: 32 GOPS |
PMIC |
NXP PCA9450 |
Memory |
Upto 8GB LPDDR4 |
Storage |
32GB eMMC (default) |
Board-to-Board Connector |
260-pin DDR4 SO-DIMM |
System on Module |
EDM SOM |
Debug Interface |
JTAG Interface by Through-hole |
|
Connectivity |
Network LAN |
1x Atheros AR8035 Gigabit LAN |
Wi-Fi |
Qualcomm Atheros QCA9377 Wi-Fi 5 – 802.11 a/b/g/n/ac (optional) |
Bluetooth |
Qualcomm Atheros QCA9377 Bluetooth (optional) |
Antenna |
MHF4 connector (optional) |
|
Signaling |
I/O |
LVDS
LAN
MIPI CSI
MIPI DSI
PCIe
USB
USB OTG
I²S
SDIO
UART
SPI
I²C
PWM
GPIO |
|
Video |
GPU Engine |
GC NanoUltra (1 shader)
GC520L (2D)
OpenGL ES 2.0 |
Video decode |
1080p60 (h.265, VP9, h.264, VP8) |
Video encode |
1080p60 H.264 |
Camera |
MIPI CSI (4 lanes) |
|
Audio |
Audio Codec |
On carrier board |
Audio Interface |
I²S (2 channel) |
|
Power Specifications |
Power Input |
5V DC +/-5% |
Power Consumption |
Depending on Configuration |
|
Operating Systems |
Standard Support |
Linux
Yocto
Android
Ubuntu |
|
Certification and Compliance |
FCC |
FCC ID: 2AKZA-QCA9377 |
IC |
IC: 22364-QCA9377 |
CE |
EN 300 328 v2.2.2
EN 301 893 v2.1.1
EN 55032 / EN 55024 |
TELEC (Japan) |
TELEC: 201-180629 |
RCM (Australia/New Zealand) |
RCM Compliant |
Certification |
Compliant with RoHS / REACH directives |
Bluetooth Logo |
QDID 150839 (Bluetooth 4.2) |
|
Environmental and Mechanical |
Dimensions |
69.6 x 35mm |
Form Factor |
EDM Type G |
Relative Humidity |
10 to 90 % |
MTBF |
100,000+ Hours |
Shock |
15G half-sine 11 ms duration |
Operation Temperature |
Commercial: 0° to +60° C
Industrial: -40° to +85° C |
Vibration |
1 Grms random 5-500Hz hr/axis |
Weight |
8 grams |
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