Intel Atom® E3900 Series
DFI launched new products to provide enhanced processing capability, low-power consumption, and brilliant graphic performance under Goldmont architecture with 14nm manufacturing node. Relying on DFI’s innovative abilities in design and manufacture, these products are small-sized, fanless, and support extended temperature range from -40°C up to +85°C, which makes it a perfect suite for many space-constrained and thermally limited embedded applications.
These products are able to survive under a wide -40°C to +85°C operating temperature range. Satisfying the demands of industries in harsh environments with the need of thermal solution designs. Also, this outstanding fanless design makes awesome system integration.
With the latest processor under Goldmont architecture, these boards offer 30% significant improvement for processing and intense graphic performance (Gen9), it also saves an average of 9 watts TDP energy.
The new series powered by enhanced graphic engine from hardware decoding of HEVC and VP9 codecs supports 4K high resolution (DP: 4096×2304 @ 60Hz) and three independent displays for medical and multimedia solution.
As for storage, these new products will support high speed SATA 3.0 drives, SSD and eMMC 5.0 options up to 128GB. Specially, advanced M.2 interface that integrating multiple functions including Wi-Fi/LTE/mSATA is the ideal choice for automation, storage and design of IoT appliances.
Based on the new E3900 series processor, DFI has created a wide array of rugged and reliable industrial motherboards and modules, including Mini-ITX, SBC, Pico-ITX, COM Express, Qseven R2.1.
Collocating with Windows 10 platform characterized by its security functions, DFI’s E3900 series products featured small-sized and rugged-design and are ready to meet IoT demands. With the integration, these products can comprehensively help our clients simplify development of IoT-connected devices and generate total IoT solution.