GAP-251R-S7 Series


GAP is a family of rugged servers and workstations with an aluminum construction, designed for applications that require robust and qualified MIL-GRADE equipment, suitable for operations in critical environments.


GAP-251R-S7 rugged servers feature dual socket 3rd Gen Intel® Xeon® Scalable Processors (Ice Lake), a balanced architecture that delivers built-in AI acceleration and advanced security capabilities, up to 64 lanes PCI Express Gen 4 per socket to enable higher I/O bandwidth per core, and +7% higher socket-to-sock et bandwidth. The integrated IPMI services support monitoring, control, and management functions sending alarm notifications in case of critical events.

GAP-251R-S7 are designed for 19” rackmounting and have a 2U chassis with a total overall length of 540mm. The 19” front bracket of the chassis is mounted in backward position so that it takes only 510mm once installed into a cabinet. The rear I/O and rear power supply layout includes dual internal M.2 NVMe socket and up to six removable U.2 NVMe SSD or up to nine removable 2.5” SAS/ SATA SSD. Optionally a DVD media is available.

GAP-251R-S7 rugged servers can host up to two OCP 3.0 compliant NIC cards with PCIe 4.0 bandwidth and a toolless, hot-swappable design, supporting GbE / 10GbE / 25GbE / 100GbE in RJ45 or SFP version. Furthermore it can accommodate six PCIe cards.
Additional boards can be provided with a dedicated retainer kit for an optimal protection against shocks and vibrations also during transport.

GAP servers are designed to meet MIL-STD-810F for temperature and shocks, MIL-STD-167-1A for vibrations. Optionally, they can conform to MIL-STD-461 for EMI /EMC.
The I/O connectors and the power supply input can be provided with MIL-GRADE connectors upon request.

All units are delivered with their inventory list to ensure configuration control and reproducibility over time. Upon request, all server configurations can run specific thermal or mechanical environmental stress test.


FEATURES

• 2U Rugged Server – 510mm depth
• Dual Socket Motherboard
• 3rd Gen Intel® Xeon® Scalable Processors
• Rear I/O connectors and rear Power Input
• Redundant AC or DC Power Supply
• 6 x U.2 NVMe SSD or 9 x 2.5” SATA/SAS SSD
• Optional DVD
• Up to 6x PCIe 4.0 cards or 2x double-width GPUs and 2x PCIe cards
• Optional Conformal Coating
• MIL-STD-810G
• Optional MIL-STD-461


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